ADL5606

Data Sheet

Rev. B | Page 18 of 18

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3

WITH EXCEPTION TO THE EXPOSED PAD.

1

0.65

BSC

16

5

8

9

12

13

4

4.10

4.00 SQ

3.90

0.50

0.40

0.30

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

*2.40

2.35 SQ

2.30

BOTTOM VIEW

TOP VIEW

SIDE VIEW

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 40. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-20)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADL5606ACPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-20

ADL5606-EVALZ

Evaluation Board

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D09968-0-9/17(B)