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MP3385A 数据表(PDF) 23 Page - Monolithic Power Systems |
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MP3385A 数据表(HTML) 23 Page - Monolithic Power Systems |
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23 / 25 page ![]() MP3385A – 4-STRING WLED CONTROLLER WITH I 2C INTERFACE MP3385A Rev. 1.01 www.MonolithicPower.com 23 8/29/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. To ensure that the chip functions properly, an appropriate OVP voltage is needed. The recommended OVP point is about 1.1 to 1.2 times higher than the output voltage for normal operation. If the OVP pin is connected to the anode of the LED load, the OVP voltage is set by the OVP4:0 bits in register 05H. It is not recommended to set the OVP value higher than 80V, considering the LED return pin voltage rating. If the MP3385A is applied for >80V output voltage applications through an external extension, connect a proper resistor (ROVP) between the anode of the LED and OVP pins to change the over-voltage point of the output (VOVP). Calculate VOVP with ROVP with Equation (14): OVP OVP R(kΩ)+1600 V(V)= *1.9 40 (14) Where the OVP4:0 bit in register 05H is the set default. Expanding LED Channels The MP3385A expands the number of LED channels by using two or three ICs in parallel. To connect two ICs for a total of eight LED strings, tie the VCC pins of the master IC and the slave IC together to power the slave IC internal logic circuitry. Tie the COMP pins of the slave IC and the master IC together to regulate the voltage of all eight strings. The slave IC MOSFET driving signals are not used. The boost converter can be driven only by the master IC. Do not leave IS of the slave IC floating; tie it to ground. Apply the EN and DIM signals to both ICs. The master IC's OVP should be higher than the slave IC's OVP. PCB Layout Guidelines Efficient PCB layout is critical to reduce EMI noise and achieve stable operation. For best results, refer to the guidelines below. 1. Keep the loop from the external MOSFET through the output diode and the output capacitor as small and short as possible since they carry a high-frequency pulse current. 2. Separate the power ground (PGND) and signal ground (GND). 3. Connect PGND and GND together. All logic signals refer to the signal ground to reduce noise affection. 4. Place the ceramic capacitors for VIN and VCC as close as possible. |
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