Data Sheet

AD8372

Rev. C | Page 13 of 16

OUTLINE DIMENSIONS

3.25

3.10 SQ

2.95

0.80

0.75

0.70

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.50

0.40

0.30

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD

SEATING

PLANE

EXPOSED

PAD

SIDE VIEW

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 17. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD8372ACPZ-WP

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP], Waffle Pack

CP-32-7

36

AD8372ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP], 7” Tape

and Reel

CP-32-7

1,500

AD8372-EVALZ

Evaluation Board