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STW13NK100Z 数据表(PDF) 3 Page - STMicroelectronics |
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STW13NK100Z 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 9 page ![]() 3/9 STW13NK100Z ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) ON/OFF DYNAMIC SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. 3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID =1mA,VGS = 0 1000 V IDSS Zero Gate Voltage Drain Current (VGS =0) VDS =Max Rating VDS =Max Rating,TC = 125 °C 1 10 µA µA IGSS Gate-body Leakage Current (VDS =0) VGS = ± 20V ±10 µA VGS(th) Gate Threshold Voltage VDS =VGS,ID = 150 µA 3 3.75 4.5 V RDS(on) (1) Static Drain-source On Resistance VGS =10V, ID = 6.5 A 0.56 0.70 Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (1) Forward Transconductance VDS =15V, ID =6.5 A 14 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V,f= 1MHz,VGS = 0 6000 455 100 pF pF pF Coss eq. (3) Equivalent Output Capacitance VGS =0V, VDS = 0V to 800V 227 pF td(on) tr td(off) tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time VDD =500 V, ID =7 A RG =4.7Ω VGS =10 V (Resistive Load see, Figure 3) 45 35 145 45 ns ns ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD =800V, ID =13 A, VGS =10V 190 30 100 266 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD ISDM (2) Source-drain Current Source-drain Current (pulsed) 13 52 A A VSD (1) ForwardOnVoltage ISD =13A,VGS =0 1.6 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD =13A,di/dt =100A/µs VDD =100 V, Tj =25°C (see test circuit, Figure 5) 820 12.7 31 ns µC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD =13A,di/dt =100A/µs VDD =100 V, Tj =150°C (see test circuit, Figure 5) 1050 17.8 34 ns µC A |
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