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In2

3

2

4

6

1

In1

In2

Y

GND

In0

DBV PACKAGE

(TOP VIEW)

YEA, YEP, YZA,

OR YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

6

1

In1

In2

Y

GND

In0

3

2

4

6

1

In1

Y

GND

In0

In1

In0

In2

Y

GND

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

4

2

3

6

5

5

5

5

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G98

CONFIGURABLE MULTIPLE-FUNCTION GATE

SCES417H – DECEMBER 2002 – REVISED JUNE 2005

•

Operation

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

•

ESD Protection Exceeds JESD 22

•

Inputs Accept Voltages to 5.5 V

– 2000-V Human-Body Model (A114-A)

•

– 200-V Machine Model (A115-A)

•

Low Power Consumption, 10-

µA Max I

CC

– 1000-V Charged-Device Model (C101)

•

±24-mA Output Drive at 3.3 V

The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of

3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC1G98YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

SN74LVC1G98YZAR

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

_ _ _CW_

NanoStar™ – WCSP (DSBGA)

SN74LVC1G98YEPR

0.23-mm Large Bump – YEP

NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

SN74LVC1G98YZPR

0.23-mm Large Bump – YZP (Pb-free)

Reel of 3000

SN74LVC1G98DBVR

SOT (SOT-23) – DBV

C98_

Reel of 250

SN74LVC1G98DBVT

Reel of 3000

SN74LVC1G98DCKR

SOT (SC-70) – DCK

CW_

Reel of 250

SN74LVC1G98DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G98DRLR

CW_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2002–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.