Data Sheet

ADL5530

Rev. C | Page 11 of 16

THEORY OF OPERATION

The basic connections for operating the ADL5530 are shown in

Figure 22. Recommended components are listed in Table 5. The

inputs and outputs should be ac coupled with appropriately

sized capacitors (device characterization was performed with

10 nF capacitors). DC bias is provided to the amplifier via an

inductor connected to the RF output pin. The bias voltage

should be decoupled using a 10 nF capacitor.

A bias voltage of 5 V is recommended. However, the device is

specified to operate down to 3 V with a slightly reduced

compression point and a reduced noise figure.

RFIN

3V TO 5V

1

2

3

4

8

7

6

5

C1

10nF

C2

10nF

RF OUT

C5

10nF

L1

470nH

NC = NO CONNECT

ADL5530

NC

IN1

NC

NC

GND

OUT1

NC

NC

Figure 22. Basic Connections

For operation down to 10 MHz, a larger biasing choke is

recommended (see Table 5) along with larger ac-coupling

capacitors. Figure 23 shows a plot of input return loss and gain

with the recommended components.

Table 5. Recommended Components for Basic Connections

Frequency

C1

C2

L1

C5

10 MHz to 50 MHz

0.1 µF

0.1 µF

3.3 µH

0.1 µF

50 MHz to 1000 MHz

10 nF

10 nF

470 nH

10 nF

20

–20

550

FREQUENCY (MHz)

15

10

5

0

–5

–10

–15

10

15

20

25

30

35

40

45

S11 (3.3µH)

S11 (470nH)

S21 (470nH)

S21 (3.3µH)

Figure 23. Performance at 10 MHz

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 24 shows the recommended land pattern for ADL5530.

To minimize thermal impedance, the exposed paddle on the

package underside should be soldered down to a ground plane

along with Pin 8. If multiple ground layers exist, they should be

stitched together using vias. Pin 1, Pin 3, Pin 4, Pin 5 and Pin 6

can be left unconnected, or can be connected to ground.

Connecting these pins to ground slightly enhances thermal

impedance.

PIN 1

0.33 mm

8

5

4

0.46mm

0.5mm

0.33mm

0.33mm

0.53mm

2.13mm

Figure 24. Recommended Land Pattern