Data Sheet

ADL5542

BASIC CONNECTIONS

The basic connections for operating the ADL5542 are shown in

Figure 20. Recommended components are listed in Table 5. The

input and output should be ac-coupled with appropriately sized

capacitors (device characterization was performed with 33 pF

capacitors). A 5 V dc bias is supplied to the amplifier via VPOS

(Pin 5) and through a biasing inductor connected to RFOUT

(Pin 8). The bias voltage should be decoupled using a 1 µF

capacitor, a 1.2 nF capacitor, and two 68 pF capacitors.

VCC

GND

GND

CB

VPOS

RFIN

RFOUT

GND

GND

ADL5542

C4

68pF

C5

1.2nF

C6

1µF

VCC

C2

33pF

C1

33pF

RFIN

RFOUT

L1

47nH

C3

1µF

GND

C7

68pF

1

2

3

4

8

7

6

5

Figure 20. Basic Connections

For operation below 500 MHz, a larger biasing choke and ac

coupling capacitors are necessary (see Table 5). Figure 21 shows

Input return loss, output return loss, and gain for frequencies

between 200 MHz and 500 MHz. The noise figure performance

for operation from 200 MHz to 500 MHz is shown in Figure 22.

–50

–40

–30

–20

–10

0

10

18.0

18.5

19.0

19.5

20.0

20.5

21.0

200

250

300

350

400

450

500

FREQUENCY (MHz)

S11

S21

S22

Figure 21. Input Return Loss (S11), Output Return Loss (S22), and

Gain (S21) vs. Frequency

1.5

2.0

2.5

3.0

3.5

4.0

200

250

300

350

400

450

500

FREQUENCY (MHz)

Figure 22. Noise Figure vs. Frequency from 200 MHz to 500 MHz

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 23 shows the recommended land pattern for the ADL5542.

To minimize thermal impedance, the exposed paddle on the

package underside should be soldered down to a ground plane

along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground

layers exist, they should be stitched together using vias (a

minimum of five vias is recommended). For more information

on land pattern design and layout, refer to Application Note

AN-772, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

PIN 1

PIN 4

PIN 8

PIN 5

1.85mm

2.03mm

1.78mm

0.5mm

0.71mm

1.53mm

Figure 23. Recommended Land Pattern

Table 5. Recommended Components for Basic Connections

Frequency

C1

C2

C3

L1

C4

C5

C6

C7

20 MHz to 200 MHz

0.1 µF

0.1 µF

1 µF

1 µH (Coilcraft 0805LS-102XJL_ or equivalent)

68 pF

1.2 nF

1 µF

68 pF

200 MHz to 500 MHz

0.1 µF

0.1 µF

1 µF

470 nH (Coilcraft 0603LS-471NXJL_ or equivalent)

68 pF

1.2 nF

1 µF

68 pF

500 MHz to 6000 MHz

33 pF

33 pF

1 µF

47 nH (Coilcraft 0603CS-47NXJL_ or equivalent)

68 pF

1.2 nF

1 µF

68 pF

Rev. C | Page 11 of 13