ADL5602

Data Sheet

Rev. A | Page 12 of 16

BASIC CONNECTIONS

The basic connections for operating the ADL5602 are shown in

Figure 16. Recommended components are listed in Table 5. The

input and output should be ac-coupled with appropriately sized

capacitors (device characterization was performed with 0.1 μF

capacitors). A 5 V dc bias is supplied to the amplifier through

the bias inductor connected to RFOUT (Pin 3). The bias voltage

should be decoupled using a 1 µF capacitor, a 1.2 nF capacitor,

and a 68 pF capacitor.

1

2

3

ADL5602

C6

1µF

L1

470nH

GND

RFIN

RFOUT

(2)

C5

1.2nF

C4

68pF

C2

0.1µF

C1

0.1µF

VCC

Figure 16. Basic Connections

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 17 shows the recommended land pattern for the ADL5602.

To minimize thermal impedance, the exposed paddle on the

package underside should be soldered down to a ground plane

along with Pin 2. If multiple ground layers exist, they should be

stitched together using vias. For more information on land

pattern design and layout, refer to the AN-772 Application

Note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

1.50mm

3.00mm

1.27mm

0.62mm

3.48mm

1.80mm

0.86mm

5.37mm

0.20mm

0.762mm

0.635mm

0.86mm

Figure 17. Recommended Land Pattern

Table 5. Recommended Components for Basic Connections

Frequency (MHz)

C1

C2

L1

C4

C5

C6

50 to 4000

0.1 µF

0.1 µF

470 nH (Coilcraft 0603LS-NX or equivalent)

68 pF

1.2 nF

1 µF