LTM8050 datasheet(2/30 Pages) LINER

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LTM8003

8003fc

For more information www.linear.com/LTM8003

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, RUN, PG Voltage .............................................. 42V

VOUT, BIAS Voltage ................................................. 19V

FB, TR/SS Voltage ..................................................... 4V

SYNC Voltage ............................................................ 6V

(Notes 1, 2)

BGA PACKAGE

48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE

TOP VIEW

ADJUSTABLE VERSION

SYNC

GND

RUN

GND

BANK 1

BIAS

VOUT

BANK2

VIN

BANK 3

TR/SS

TJMAX = 150°C, θJA = 23.5°C/W, θJCbottom = 3.2°C/W

θJCtop = 17.9°C/W, θJB = 3.1°C/W, WEIGHT = 0.5g

θ VALUES DETERMINED PER JEDEC51-9, 51-12

BGA PACKAGE

48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE

TOP VIEW

FIXED OUTPUT VERSION

SYNC

GND

RUN

BIAS

BANK2

VIN

TR/SS

GND

BANK 1

VOUT

BANK 3

TJMAX = 150°C, θJA = 23.5°C/W, θJCbottom = 3.2°C/W

θJCtop = 17.9°C/W, θJB = 3.1°C/W, WEIGHT = 0.5g

θ VALUES DETERMINED PER JEDEC51-9, 51-12

ORDER INFORMATION (http://www.linear.com/product/LTM8003#orderinfo)

PART NUMBER

TERMINAL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

DEVICE

FINISH CODE

LTM8003IY#PBF

SAC305 (RoHS)

LTM8003

BGA

–40°C to 125°C

LTM8003HY#PBF

SAC305 (RoHS)

LTM8003

BGA

–40°C to 150°C

LTM8003IY

SnPb (63/37)

LTM8003

BGA

–40°C to 125°C

LTM8003HY

SnPb (63/37)

LTM8003

BGA

–40°C to 150°C

LTM8003-3.3IY#PBF

SAC305 (RoHS)

LTM8003-3.3

BGA

–40°C to 125°C

LTM8003-3.3HY#PBF

SAC305 (RoHS)

LTM8003-3.3

BGA

–40°C to 150°C

• Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• Recommended BGA PCB Assembly and Manufacturing Procedures:

www.linear.com/umodule/pcbassembly

• BGA Package and Tray Drawings: www.linear.com/packaging

Maximum Internal Temperature (I-Grade) ........... 125°C

Maximum Internal Temperature (H-Grade) ......... 150°C

Storage Temperature (I-Grade) ........................... 125°C

Storage Temperature (H-Grade) ........... –50°C to 150°C

Peak Reflow Solder Body Temperature ............... 250°C

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