LTM8050

2

8050fc

ABSOLUTE MAXIMUM RATINGS

FB, RT, SHARE Voltage ...............................................5V

PGOOD, SYNC, BIAS.................................................25V

Maximum Junction Temperature (Note 2) ............ 125°C

Solder Temperature............................................... 245°C

Storage Temperature............................................. 125°C

(Notes 1, 3)

ORDER INFORMATION

PIN CONFIGURATION

GND

1

A

B

C

BANK 1

BANK 2

BANK 3

D

E

F

G

H

J

K

L

2

3

4

TOP VIEW

BGA PACKAGE

70-PIN (15mm

× 9mm × 4.92mm)

5

6

7

RT

SHARE

PGOOD

FB

SYNC

RUN/SS

AUX

BIAS

θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER

WEIGHT = 1.8 GRAMS

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM8050EY#PBF

SAC305 (RoHS)

LTM8050Y

e1

BGA

3

–40°C to 125°C

LTM8050IY#PBF

SAC305 (RoHS)

LTM8050Y

e1

BGA

3

–40°C to 125°C

LTM8050IY

SnPb (63/37)

LTM8050Y

e0

BGA

3

–40°C to 125°C

LTM8050MPY#PBF

SAC305 (RoHS)

LTM8050Y

e1

BGA

3

–55°C to 125°C

LTM8050MPY

SnPb (63/37)

LTM8050Y

e0

BGA

3

–55°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

www.linear.com/packaging

http://www.linear.com/product/LTM8050#orderinfo