LTM8056

2

8056fa

For more information www.linear.com/LTM8056

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

FB, SYNC, CTL, MODE Voltage ...................................6V

LL Voltage.................................................................15V

Maximum Junction Temperature (Notes 2, 3)....... 125°C

Storage Temperature.............................. –55°C to 125°C

Peak Solder Reflow Body Temperature ................. 245°C

(Note 1)

BANK 2

A

IOUT

LL

CLKOUT

RT FB SS

MODE SYNC

COMP

CTL

1

11

10

9

8

7

6

5

4

3

2

K

J

L

H

G

F

E

D

C

B

BGA PACKAGE

121-LEAD (15mm × 15mm × 4.92mm)

BANK 1

GND

BANK 3

TOP VIEW

RUN

GND

WEIGHT = 2.8g, θ VALUES DETERMINED PER JEDEC JESD51-9, 51-12

ORDER INFORMATION

PART NUMBER

BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(Note 2)

DEVICE

FINISH CODE

LTM8056EY#PBF

SAC305 (RoHS)

LTM8056Y

e1

BGA

3

–40°C to 125°C

LTM8056IY#PBF

SAC305 (RoHS)

LTM8056Y

e1

BGA

3

–40°C to 125°C

LTM8056IY

SnPb (63/37)

LTM8056Y

e0

BGA

3

–40°C to 125°C

LTM8056MPY#PBF

SAC305 (RoHS)

LTM8056Y

e1

BGA

3

–55°C to 125°C

LTM8056MPY

SnPb (63/37)

LTM8056Y

e0

BGA

3

–55°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges.

*Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

www.linear.com/packaging

http://www.linear.com/product/LTM8056#orderinfo