LTM8073

2

8073fa

For more information www.linear.com/LTM8073

pin conFiguraTion

absoluTe MaxiMuM raTings

(Notes 1, 2)

A

1

2

3

4

5

6

BANK 2

TOP VIEW

GND

RUN

TR/SS

RT

SYNC

SHARE

PG

AUX

BIAS

FB

GND

BANK 1

GND

BANK 3

B

C

D

E

F

G

H

48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

PG Voltage ................................................................42V

FB, TR/SS Voltage.......................................................4V

SYNC Voltage..............................................................6V

Maximum Internal Temperature (Note 4) .............. 125°C

Storage Temperature.............................. –55°C to 125°C

Peak Solder Reflow (Package Body) Temperature..250°C

PART NUMBER

TERMINAL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(Note 3)

DEVICE

FINISH CODE

LTM8073EY#PBF

SAC305 (RoHS)

LTM8073

e1

BGA

3

–40°C to 125°C

LTM8073IY#PBF

• Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• Recommended BGA PCB Assembly and Manufacturing Procedures:

www.linear.com/umodule/pcbassembly

• BGA Package and Tray Drawings: www.linear.com/packaging

orDer inForMaTion http://www.linear.com/product/LTM8073#orderinfo