LTM8067

2

8067fc

For more information www.linear.com/LTM8067

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Maximum Internal Temperature (Note 4) .............. 125°C

Peak Solder Reflow Body Temperature ................. 245°C

Storage Temperature.............................. –55°C to 125°C

(Note 1)

TOP VIEW

H

G

F

E

D

C

B

A

1

2

3

4

5

6

7

BANK 2

BANK 1

BANK 4

GND

RUN

FB

BANK 5

BGA PACKAGE

38-LEAD (11.25mm

× 9mm × 4.92mm)

WEIGHT = 1.1g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE (SEE NOTE 4)

DEVICE

CODE

LTM8067EY#PBF

SAC305 (RoHS)

LTM8067Y

e1

BGA

3

–40°C to 125°C

LTM8067IY#PBF

SAC305 (RoHS)

LTM8067Y

e1

BGA

3

–40°C to 125°C

LTM8067IY

SnPb (63/37)

LTM8067Y

e0

BGA

3

–40°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

www.linear.com/packaging

http://www.linear.com/product/LTM8067#orderinfo