SFH 421, SFH 426

2002-03-14

7

Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage.

For additional information on general soldering conditions please contact us.

Published by OSRAM Opto Semiconductors GmbH & Co. OHG

Wernerwerkstrasse 2, D-93049 Regensburg

© All Rights Reserved.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

Löthinweise

Soldering Conditions

Bauform

Types

Tauch-, Schwall- und Schlepplötung

Dip, Wave and Drag Soldering

Reflowlötung

Reflow Soldering

Lötbad-

temperatur

Temperature

of the

Soldering

Bath

Maximal

zulässige

Lötzeit

Max. Perm.

Soldering

Time

Abstand

Lötstelle –

Gehäuse

Distance

between

Solder Joint

and Case

Lötzonen-

temperatur

Temperature

of Soldering

Zone

Maximale

Durchlaufzeit

Max. Transit

Time

TOPLED

®

SIDELED

260

°C

260

°C

8 s

8 s

–

–

245

°C

245

°C

10 s

10 s