LTC6261/LTC6262/LTC6263

22

626123fa

For more information www.linear.com/LTC6261

pAckAge Description

Please refer to http://www.linear.com/product/LTC6262#packaging for the most recent package drawings.

MSOP (MS8) 0213 REV G

0.53 ±0.152

(.021 ±.006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.1016 ±0.0508

(.004 ±.002)

0.86

(.034)

REF

0.65

(.0256)

BSC

0° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

1 2 3 4

4.90 ±0.152

(.193 ±.006)

8 7 6 5

3.00 ±0.102

(.118 ±.004)

(NOTE 3)

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

0.52

(.0205)

REF

5.10

(.201)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ±0.127

(.035 ±.005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 ± 0.038

(.0165 ±.0015)

TYP

0.65

(.0256)

BSC

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev G)