LS-M676 datasheet(13/15 Pages) OSRAM

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LS-M676 数据表(PDF) 13 Page - OSRAM GmbH

13 / 15 page

LS M676, LA M676, LO M676, LY M676

2002-10-18

Empfohlenes Lötpaddesign

IR Reflow Löten

Recommended Solder Pad

IR Reflow Soldering

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

0.8 (0.031)

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