LS-T776 datasheet(13/15 Pages) OSRAM

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LS-T776 数据表(PDF) 13 Page - OSRAM GmbH

13 / 15 page

LS T776, LA T776, LO T776, LY T776

2002-10-18

Empfohlenes Lötpaddesign

IR Reflow Löten

Recommended Solder Pad

IR Reflow Soldering

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat

OHLPY977

1.5 (0.059)

6 (0.236)

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

for improved

Wärmeableitung

für verbesserte

Padgeometrie

Paddesign

Solder resist

Lötstopplack

6 (0.236)

1.5 (0.059)

Hole on PCB

2.8 (0.110)

2.4 (0.094)

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