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ISL9113AIRAZ-T 数据表(PDF) 6 Page - Renesas Technology Corp |
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ISL9113AIRAZ-T 数据表(HTML) 6 Page - Renesas Technology Corp |
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6 / 10 page ![]() ISL9113A FN8620 Rev 1.00 Page 6 of 10 January 4, 2017 copper area connected to the thermal pad is preferable. It is recommended to add at least four vias within the pad to the GND plane for the best thermal relief. Output Voltage Setting Resistor Selection Resistors R1 and R2, shown in the “Block Diagram” on page 2, can be used to set the desired output voltage values using Equation 1: where VFB is the internal FB reference voltage (0.8V typical). The current flowing through the divider resistors is calculated as VOUT /(R1 + R2). Large resistance is recommended to minimize current into the divider, and thus improve the total efficiency of the converter. R1 and R2 should be placed close to the FB pin of the device to prevent noise pickup. Inductor Selection An inductor with core material suitable for high-frequency applications (e.g., ferrite) is desirable to minimize core loss and improve efficiency. The inductor should have a low ESR to reduce copper loss. Moreover, the inductor saturation current should be higher than the maximum peak current of the device; i.e., 1.5A. The device is designed to operate with an inductor value of 2.2µH to provide stable operation across the range of load, input, and output voltages. Stable mode switching between PWM and Skip mode operation is guaranteed at this inductor value. Table 1 shows recommended inductors. Capacitor Selection INPUT CAPACITOR A minimum of a 4.7µF ceramic capacitor is recommended to provide stable operation under typical operating conditions. For input voltage less than 1.0V application, an additional 4.7µF ceramic capacitor is recommended for better noise filtering and EMI suppression. The input capacitor should be placed close to the input pin, GND pin, and the non-switching terminal of the inductor. OUTPUT CAPACITOR For the output capacitor, a ceramic capacitor with small ESR is recommended to minimize output voltage ripple. A typical 4.7µF should be used to provide stable operation at different typical operating conditions. The output capacitor should be placed close to the output pin and GND pin of the device. Table 2 shows the recommended capacitors. TABLE 1. INDUCTOR VENDOR INFORMATION MANUFACTURER PART NUMBER DIMENSIONS - W x L x H (mm) Murata LQH32PN2R2NN0L 3.2 x 2.5 x 1.7 (maximum) Toko 1239AS-H-2R2M 2.5 x 2.0 x 1.2 (maximum) 1286AS-H-2R2M 2.0 x 1.6 x 1.2 (maximum) TDK TFM201610A-2R2M 2.0 x 1.6 x 1.0 (maximum) Cyntec PSE25201B-2R2MS 2.0 x 1.6 x 1.2 (maximum) FIGURE 4. RECOMMENDED PCB LAYOUT VOUT VFB 1 R1 R2 ------- + = (EQ. 1) TABLE 2. CAPACITOR VENDOR INFORMATION MANUFACTURER SERIES WEBSITE AVX X5R www.avx.com Murata X5R www.murata.com Taiyo Yuden X5R www.t-yuden.com TDK X5R www.tdk.com TABLE 3. FAULT DETECTION AND RESPONSE FAULT CONDITION DETECTION DETAILS ACTION Low Battery Voltage VBAT < 0.7V Shut down until VEN or VBAT is cycled. VOUT Out of Regulation VOUT is 10% below the target output voltage Shut down only if VBAT and VOUT fall below 2.1V. Device automatically restarts after 200ms. Short-Circuit VOUT falls below VBAT Shut down immediately. Device automatically restarts after 200ms. Over-Temperature Protection Die temperature is > +150°C Switching stops. Device automatically restarts when temperature decreases to +125°C. Output Overvoltage Protection VOUT > 5.9V Switching stops until EN pin is toggled or power is cycled. |
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