Data Sheet

ADL5523

Rev. C | Page 21 of 21

OUTLINE DIMENSIONS

8

1

5

4

0.30

0.25

0.20

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50

BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED-4

TOP VIEW

BOTTOM VIEW

SIDE VIEW

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 65. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADL5523ACPZ-R7

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-13

Q1J

ADL5523-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D06829-0-9/17(C)