FN4567 Rev 3.00

Page 14 of 15

November 9, 2004

HIP6004B

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HIP6004B

Thin Shrink Small Outline Plastic Packages (TSSOP)



INDEX

AREA

E1

D

N

12

3

-B-

0.10(0.004)

C A

M

BS

e

-A-

b

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

c

E

0.25(0.010)

B

M

M

L

0.25

0.010

GAUGE

PLANE

A2

NOTES:

1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AC, Issue E.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-

sion at maximum material condition. Minimum space between protru-

sion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact. (Angles in degrees)

0.05(0.002)

M20.173

20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC

PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

-

0.047

-

1.20

-

A1

0.002

0.006

0.05

0.15

-

A2

0.031

0.051

0.80

1.05

-

b

0.0075

0.0118

0.19

0.30

9

c

0.0035

0.0079

0.09

0.20

-

D

0.252

0.260

6.40

6.60

3

E1

0.169

0.177

4.30

4.50

4

e

0.026 BSC

0.65 BSC

-

E

0.246

0.256

6.25

6.50

-

L

0.0177

0.0295

0.45

0.75

6

N20

20

7



-

Rev. 1 6/98