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ISL26321 数据表(PDF) 22 Page - Renesas Technology Corp |
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ISL26321 数据表(HTML) 22 Page - Renesas Technology Corp |
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22 / 23 page ![]() ISL26310, ISL26311, ISL26312, ISL26313, ISL26314, ISL26315, ISL26319 FN7549 Rev 3.00 Page 22 of 23 August 18, 2015 Package Outline Drawing M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 2, 5/10 0.09-0.20 SEE DETAIL "X" DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW END VIEW Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. Dimensions are measured at datum plane H. Dimensioning and tolerancing per ASME Y14.5M-1994. Dimension does not include dambar protrusion. Allowable protrusion shall be 0.08mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm. Dimension in ( ) are for reference only. Conforms to JEDEC MO-153. 6. 3. 5. 4. 2. 1. NOTES: 7. (0.65 TYP) (5.65) (0.35 TYP) 0.90 +0.15/-0.10 0.60 ±0.15 0.15 MAX 0.05 MIN PLANE GAUGE 0°-8° 0.25 1.00 REF (1.45) 16 2 1 3 8 B 1 3 9 A PIN #1 I.D. MARK 5.00 ±0.10 6.40 4.40 ±0.10 0.65 1.20 MAX SEATING PLANE 0.25 +0.05/-0.06 5 C H 0.20 C B A 0.10 C - 0.05 0.10 C B A M |
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