ISL26320, ISL26321, ISL26322, ISL26323, ISL26324, ISL26325, ISL26329

FN8273 Rev 1.00

Page 3 of 23

September 5, 2013

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

DESCRIPTION

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG

DWG #

RESOLUTION

(Bits)

SPEED

(kHz)

INPUT

(SE/DIFF)

INPUT

CHANNELS

ISL26320FBZ

26320 FBZ

12

250

Diff

1

-40 to +125

8 Ld SOIC

M8.15

ISL26321FBZ

26321 FBZ

12

250

SE

1

-40 to +125

8 Ld SOIC

M8.15

ISL26322FVZ

26322 FVZ

12

250

Diff

2

-40 to +125

16 Ld TSSOP

M16.173

ISL26323FBZ

26323 FBZ

12

250

SE

2

-40 to +125

8 Ld SOIC

M8.15

ISL26324FVZ

26324 FVZ

12

250

Diff

4

-40 to +125

16 Ld TSSOP

M16.173

ISL26325FVZ

26325 FVZ

12

250

SE

4

-40 to +125

16 Ld TSSOP

M16.173

ISL26329FVZ

26329 FVZ

12

250

SE

8

-40 to +125

16 Ld TSSOP

M16.173

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-

free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL26320, ISL26321, ISL26322, ISL26323, ISL26324, ISL26325,

ISL26329. For more information on MSL please see techbrief TB363.