Reference only

P.14 /15

MURATA MANUFACTURING CO., LTD

5) Please do not apply excessive strain force or shock to this product that deviates from the

conditions in this specification, because mechanical failure or damage could occur.

6) Please thoroughly evaluate this product in your manufacturing if you will use any conformal coating

or potting process. These processes (for instance, in case resin type of material is used) could

result in package breaks, due to heat shrink. Also, humidity that remains inside of the case, may

affect circuit operation due to decreased insulation resistance value.

7) Physical and environmental characteristics for this product are described in this specification.

Please consider these characteristics in evaluating this part in your product.

8) Please carefully design the application’s housing to minimize dew and humidity. An amplifier circuit

would have high impedance, 50M ohm for instance, but this value may decrease under a high

humid environment. Due to this; you may not be able to see the intended performance from your

circuit design, unless you consider theses factors in your product design.

9) Please do not use this product in the presence of radiation rays or cosmic rays.

10) Please do not use this product in the presence of high electromagnetic fields.

11) Please consider the possibility of unexpected output signal-level generated by sharp temperature

change. Please evaluate this product under all expected environmental conditions.

We

recommend a fail-safe function to compensate for any unexpected signal levels.

12) Pyroelectric noise may be seen on the output signal of this product, where there is a temperature

variation (delta-t) around the product. Delta-t may likely occur by airflow that is generated by a

cooling fan that is often used in a computer. If your application requires a very small acceleration

resolution, less than 0.1G with 50Hz or less for instance, we would suggest shutting off the airflow

for increased accuracy in sensor detection.

13) This product is very sensitive to bending stress occurring on PCB, therefore please locate the

sensor in an area on the PCB that is unaffected by bending stresses.

16.

Caution (Mounting)

16-1. Reflow soldering

1) Please use the standard footprint as shown in the specification. If you use a different one, we shall

not be liable for any claims.

2) Please follow soldering conditions described in the specification. This product can permanently

stop operating if the piezoelectric characteristic is decreased due to excessive heating.

3) Please follow the recommended washing conditions, as described in the specification.

4) Please make sure to evaluate the soldering condition with this product mounted on your PCB.

<Reflow temperature profile (reference only)>

16-2. Soldering Iron

Use iron (3mm diameter or less, 45W max.) and iron temp should be 300

°C max.

within 3 sec. at only one point. Please take care to avoid soldering iron from touching the

product directly.

Peak Temp.

245

°C max.

Gradual cooling

in air

Pre-heating

in air

60 to 120 sec.

Within 30 sec.

100

150

180

230