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CP80C88Z 数据表(PDF) 39 Page - Renesas Technology Corp |
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CP80C88Z 数据表(HTML) 39 Page - Renesas Technology Corp |
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39 / 39 page ![]() 80C88 FN2949 Rev.5.00 Page 39 of 39 Sep 28, 2017 Ceramic Dual-In-Line Frit Seal Packages (CERDIP) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) can be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. bbb C A - B S c Q L A SEATING BASE D PLANE PLANE -D- -A- -C- -B- D E S1 b2 b A e M c1 b1 (c) (b) SECTION A-A BASE LEAD FINISH METAL eA/2 A M S S ccc C A - B M D S S aaa CA - B M D S S eA F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A) 40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.225 - 5.72 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 2.096 - 53.24 5 E 0.510 0.620 12.95 15.75 5 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC - eA/2 0.300 BSC 7.62 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.070 0.38 1.78 6 S1 0.005 - 0.13 - 7 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 N40 40 8 Rev. 0 4/94 For the most recent package outline drawing, see F40.6. |
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