Data Sheet

AD8317

Rev. C | Page 19 of 19

OUTLINE DIMENSIONS

SEATING

PLANE

0.30

0.23

0.18

0.203 REF

0.80

0.75

0.70

1.89

1.74

1.59

0.50 BSC

0.20 MIN

0.60

0.45

0.30

0.55

0.40

0.30

BOTTOM VIEW

4

1

5

8

3.25

3.00

2.75

2.25

2.00

1.75

TOP VIEW

0.05 MAX

0.02 NOM

EXPOSED PAD

PIN 1 INDEX

AREA

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 40. 8-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-23)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

AD8317ACPZ-R7

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-23

Q1

AD8317ACPZ-R2

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-23

Q1

AD8317ACPZ-WP

−40°C to +85°C

8-Lead LFCSP, Waffle Pack

CP-8-23

Q1

AD8317ACHIPS

−40°C to +85°C

Die

AD8317-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

©2005–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D05541-0-8/17(C)