AD8318

Data Sheet

Rev. D | Page 24 of 24

OUTLINE DIMENSIONS

4.10

4.00 SQ

3.90

0.35

0.30

0.25

2.25

2.10 SQ

1.95

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.70

0.60

0.50

SEATING

PLANE

0.05 MAX

0.02 NOM

0.203 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

SIDE VIEW

Figure 51. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-23)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Ordering

Quantity

AD8318ACPZ-REEL7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

1,500

AD8318ACPZ-R2

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

250

AD8318ACPZ-WP

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

64

AD8318-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D04853-0-12/17(D)