ADL5304ACPZ-R2 datasheet(29/32 Pages) AD

29 / 32 page

Data Sheet

ADL5304

Rev. A | Page 29 of 32

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.20 MIN

2.85

2.70 SQ

2.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-2.

Figure 61. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-21)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Ordering

Quantity

Package

Option

ADL5304ACPZ-R2

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

250

CP-32-21

ADL5304ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP], 7”Tape and Reel

1500

CP-32-21

ADL5304ACPZ-RL

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP], 13”Tape and Reel

5000

CP-32-21

ADL5304-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

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