ADA4303-2

Data Sheet

Rev. A | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

5.5 V

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This

is a stress rating only; functional operation of the product

at these or any other conditions above those indicated in

the operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

specified for a device (including exposed pad) soldered to

the circuit board.

Table 3. Thermal Resistance

Package Type

Unit

12-Lead LFCSP (exposed pad)

99.2

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4303-2

package is limited by the associated rise in junction temp-

glass transition temperature, the plastic changes the properties.

Even temporarily exceeding this temperature limit can change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4303-2.

Exceeding a junction temperature of 150°C for an extended

period can result in changes in the silicon devices,

potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the

upon the particular application. The power due to load drive is

calculated by multiplying the load current by the associated

voltage drop across the device. RMS voltages and currents must

be used in these calculations.

addition, more metal directly in contact with the package

leads/exposed pad from metal traces, through-holes, ground,

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 12-lead LFCSP

(99.2°C/W) on a JEDEC standard 4-layer board.

0

–40

–20

AMBIENT TEMPERATURE (°C)

0.5

1.0

2.0

1.5

2.5

–60

0

20

40

60

80

100

120

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION