Data Sheet

ADN2891

Rev. B | Page 13 of 16

OUTLINE DIMENSIONS

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.65

1.50 SQ

1.45

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.50

0.40

0.30

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

TO JEDEC STANDARDS MO-220-WEED-6.

SEATING

PLANE

TOP VIEW

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 22. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-27)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADN2891ACPZ-500RL7

–40°C to +95°C

16-Lead LFCSP, 500 pieces

CP-16-27

F04

ADN2891ACPZ-RL7

–40°C to +95°C

16-Lead LFCSP, 1,500 pieces

CP-16-27

F04

ADN2891ACPZ-RL

–40°C to +95°C

16-Lead LFCSP, 5,000 pieces

CP-16-27

F04

EVAL-ADN2891EBZ

Evaluation Board