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FPF2003 数据表(PDF) 11 Page - ON Semiconductor

部件名 FPF2003
功能描述  Advanced Load Management Products
PDF  14 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

FPF2003 数据表(HTML) 11 Page - ON Semiconductor

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www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
Application Information
Typical Application
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or a short-circuit, a capacitor needs to be placed
between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be
placed close to the VIN pin. A higher value of CIN can be used to
further reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
Output Capacitor
A 0.1µF capacitor COUT, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. For the
FPF2000-FPF2002 and the FPF2004-FPF2006, the total output
capacitance needs to be kept below a maximum value,
COUT(max), to prevent the part from registering an over-current
condition and turning-off the switch. The maximum output
capacitance can be determined from the following formula,
Due to the integral body diode in the PMOS switch, a CIN
greater than COUT is highly recommended. A COUT greater than
CIN can cause VOUT to exceed VIN when the system supply is
removed. This could result in current flow through the body
diode from VOUT to VIN.
Power Dissipation
During normal operation as a switch, the power dissipation is
small and has little effect on the operating temperature of the
part. The parts with the higher current limits will dissipate the
most power and that will only be,
If the part goes into current limit the maximum power dissipation
will occur when the output is shorted to ground. For the
FPF2000, FPF2001, FPF2004 and FPF2005, the power
dissipation will scale by the Auto-Restart Time, tRESTART, and
the Over Current Blanking Time, tBLANK, so that the maximum
power dissipated is,
When using the FPF2002 and FPF2006 attention must be given
to the manual resetting of the part. Continuously resetting the
part at a high duty cycle when a short on the output is present
can cause the temperature of the part to increase. The junction
temperature will only be allowed to increase to the thermal
shutdown threshold. Once this temperature has been reached,
toggling ON will not turn-on the switch until the junction
temperature drops. For the FPF2003 and FPF2007, a short on
the output will cause the part to operate in a constant current
state dissipating a worst case power as calculated in (3) until
the thermal shutdown activates. It will then cycle in and out of
thermal shutdown so long as the ON pin is active and the short
is present.
Board Layout
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
OFF ON
ON
VIN
GND
FPF2000 - FPF2007
FLAGB
VOUT
LOAD
1.8V-5.5V
C1 = 4.7µF
R1 = 100K
C2 = 0.1µF
R2 = 500
C
OUT
I
LIM max
() t
BLANK min
()
×
V
IN
--------------------------------------------------------------------
=
(1)
PI
LIM
()
2
R
DS
×
0.2
()
2
0.7
×
28mW
==
=
(2)
Pmax
()
t
BLANK
t
RESTART
t
BLANK
+
---------------------------------------------------x V
IN max
()
()xI
LIM max
()
==
10
80
10
+
-------------------
5.5
×
0.2
×
1.22mW
=
(3)
=



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