AD8128

Data Sheet

Rev. A | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±5.5 V

Input Voltage

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

8-Lead LFCSP

77

14

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8128 package is

die. At approximately 150°C, which is the glass transition temp-

erature, the plastic changes the properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8128. Exceeding a junction temperature

of 150°C for an extended period can result in changes in the

silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for the output. The quiescent power

upon the particular application. For each output, the power due

to load drive is calculated by multiplying the load current by the

associated voltage drop across the

more metal directly in contact with the package leads from metal

The exposed pad on the underside of the package must be

soldered to a pad on the PCB surface, which is thermally connected

Figure 2 shows the maximum safe power dissipation in the package

vs. the ambient temperature for the 8-lead LFCSP (48.5°C/W) on a

JEDEC standard 4-layer board with the underside pad soldered to a

pad that is thermally connected to a PCB plane. Extra thermal

relief is required for operation at high supply voltages.

3.0

0

–30

–40

–10

–20

10

0

30

20

50

40

70

60

90

80

110

100

130

120

AMBIENT TEMPERATURE (°C)

2.5

2.0

1.5

1.0

0.5

Figure 2. Maximum Power Dissipation vs. Temperature

ESD CAUTION