Data Sheet

ADL5391

Rev. A | Page 15 of 15

OUTLINE DIMENSIONS

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.65

1.50 SQ

1.45

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.50

0.40

0.30

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

TO JEDEC STANDARDS MO-220-WEED-6.

SEATING

PLANE

SIDE VIEW

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 26. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-27)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Ordering Quantity

ADL5391ACPZ-R2

−40°C to +85°C

16-Lead LFCSP

CP-16-27

250

ADL5391ACPZ-R7

−40°C to +85°C

16-Lead LFCSP

CP-16-27

1,500

ADL5391ACPZ-WP

−40°C to +85°C

16-Lead LFCSP

CP-16-27

50

ADL5391-EVALZ

Evaluation Board

1

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registered trademarks are the property of their respective owners.

D06059-0-10/17(A)