AD8436ACPZ-R7 datasheet(20/21 Pages) AD

20 / 21 page

AD8436

Data Sheet

Rev. E | Page 20 of 21

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-11.

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.75

2.60 SQ

2.35

BOTTOM VIEW

TOP VIEW

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 49. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-20-8)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-137-AD

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

SEATING

PLANE

0.010 (0.25)

0.004 (0.10)

0.012 (0.30)

0.008 (0.20)

0.025 (0.64)

BSC

0.041 (1.04)

REF

0.010 (0.25)

0.006 (0.15)

0.050 (1.27)

0.016 (0.41)

0.020 (0.51)

0.010 (0.25)

8°

0°

COPLANARITY

0.004 (0.10)

0.065 (1.65)

0.049 (1.25)

0.069 (1.75)

0.053 (1.35)

0.345 (8.76)

0.341 (8.66)

0.337 (8.55)

0.158 (4.01)

0.154 (3.91)

0.150 (3.81) 0.244 (6.20)

0.236 (5.99)

0.228 (5.79)

Figure 50. 20-Lead Shrink Small Outline Package [QSOP]

(RQ-20)

Dimensions shown in inches and (millimeters)

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