Data Sheet

SSM2212

Rev. C | Page 11 of 12

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8

5

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 20. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters (and inches)

3.10

3.00 SQ

2.90

0.30

0.23

0.18

1.75

1.60 SQ

1.45

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

Figure 21. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-22)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

SSM2212RZ

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

SSM2212RZ-R7

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

SSM2212RZ-RL

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

SSM2212CPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-22

A3F

SSM2212CPZ-RL

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-22

A3F

1

Z = RoHS Compliant Part.