7

XM7

■Precautions

●Automatic Soldering

Reference Information: Automated Soldering Conditions

(Jet Flow)

(1) Soldering temperature: 250

±5°C

(2) Continuous soldering time: 5

±1 s max.

●Soldering Conditions

• Reference Information: Reflow Conditions

Maximum temperature: 260

°C

Time: 5 to 15 s max.

These conditions, however, depend on the type of solder, the

manufacturer, the amount of solder, the size of the board, and

the other mounting materials.

●Metal Mask for Cream Solder Printing

We recommend a metal mask thickness of 0.15 mm when print-

ing cream solder.

The appropriate conditions, however, depend on the type of sol-

der, the manufacturer, the amount of solder, the size of the circuit

board, other mounting materials, and other conditions.

●Terminal Shapes

The terminals will deform if they are subjected to an excessive

load, which will in turn reduce solderability when mounting. Do

not drop the Connectors or handle them carelessly. Do not con-

nect anything when the Connectors are not mounted to a board.

Doing so may deform the terminals.

●Mating

Do not connect the connectors in the wrong direction.

Doing so will damage the connectors.

●Using an Automatic Solder Bath after Reflow

Mask the mating portion with tape before you perform automatic

soldering to prevent flux or solder from entering the mating por-

tion of the Connector. Select and use a suitable masking tape.

●Application Precautions

• Confirm that there is no excessive misalignment or inclination

in the mating contact portion between the plug and socket

before mating the Connector. Make sure that the Connector is

mated all the way to the back. If the Connector is not mated all

the way to the back, contact reliability may be lost.

• Do not apply an extreme load during Connector insertion or

removal. The Connector may be damaged, and contact failure

may result. Twist the plug and socket as little as possible when

mating the Connector. Not doing so may deform the terminals

or housing or crack the housing.

• Do not insert a foreign object, such as tweezers, into the Con-

nector mating contact portion. Doing so may cause the plating

to peel off or deform the terminals.

●Precautions for Board Mounting

Be careful of the amount of board warping. If the board is exces-

sively warped, soldering faults may occur.

●Storage

Do not store the Connectors in locations subject to dust or high

humidity. Do not store the Connectors in locations close to

sources of gasses such ammonia gas or sulfide gas.

Precautions for Correct Use

Preheating time:

60 s max.

Soldering time:

5 to 15 s max.

Preheating temperature

Soldering temperature

Peak temperature

(

°C)

(s)

150

250

260