MDS 2309 D

7

Revision 052405

In te gr ated Circuit Systems

ICS2309

Package dimensions are kept current with JEDEC Publication No. 95

Thermal Characteristics for 16SOIC

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θ

JA

Still air

120

°C/W

θ

JA

1 m/s air flow

115

°C/W

θ

JA

3 m/s air flow

105

°C/W

Thermal Resistance Junction to Case

θ

JC

58

°C/W

INDEX

AREA

1

2

16

D

E

SEATING

PLANE

A1

A

e

- C -

B

.10 (.004)

C

C

L

H

h x 45

Millimeters

Inches

Symbol

Min

Max

Min

Max

A

1.35

1.75

.0532

.0688

A1

0.10

0.25

.0040

.0098

B

0.33

0.51.013.020

C

0.19

0.25

.0075

.0098

D

9.80

10.00

.3859

.3937

E

3.80

4.00

.1497

.1574

e

1.27 BASIC

0.050 BASIC

H

5.80

6.20

.2284

.2440

h

0.25

0.50.010.020

L

0.40

1.27.016.050

α

0

°

8

°

0

°

8

°