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STW81100ATR 数据表(PDF) 21 Page - STMicroelectronics |
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STW81100ATR 数据表(HTML) 21 Page - STMicroelectronics |
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21 / 23 page ![]() 21/23 STW81100 9 Package Information Figure 24. VFQFPN28 Mechanical Data & Package Dimensions OUTLINE AND MECHANICAL DATA REF. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 0.800 0.900 1.000 0.031 0.035 0.039 A1 0.020 0.050 0.0008 0.0019 A2 0.650 1.000 0.025 0.039 A3 0.200 0.0078 b 0.180 0.250 0.300 0.007 0.0098 0.012 D 4.850 5.000 5.150 0.191 0.197 0.203 D1 4.750 0.187 D2 1.250 2.700 3.250 0.049 0.106 0.128 E 4.850 5.000 5.150 0.191 0.197 0.203 E1 4.750 0.187 E2 1.250 2.700 3.250 0.049 0.106 0.128 e 0.500 0.020 L 0.350 0.550 0.750 0.014 0.022 0.029 P 0.60 0.0236 K 14˚ 14˚ ddd 0.080 0.003 Notes: 1) VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Packages No lead. Very thin: A = 1.00 Max. 2) The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other fea- ture of package body. Exact shape and size of this feature is optional. VFQFPN-28 (5x5x1.0mm) Very Fine Quad Flat Package No lead 7655832 A |
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