Data Sheet

ADV3003

Rev. A | Page 15 of 16

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.23

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.25 MIN

4.45

4.30 SQ

4.25

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5.

40

1

11

20

21

30

31

10

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 29. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-10)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

ADV3003ACPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-10

490

ADV3003ACPZ-R7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP], Reel 7

CP-40-10

1500

ADV3003-EVALZ

Evaluation Board