74FST3257

www.onsemi.com

8

PACKAGE DIMENSIONS

QFN16

MN SUFFIX

CASE 485AW

ISSUE O

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.80

3.80

1.10

0.50

0.60

16X

0.30

16X

DIMENSIONS: MILLIMETERS

1

2.10

PITCH

PACKAGE

OUTLINE

DIM

MIN

MAX

MILLIMETERS

A

A1

0.00

0.05

A3

b

0.20

0.30

D

2.50 BSC

D2

0.85

1.15

E

3.50 BSC

E2

e

0.50 BSC

K

0.20

---

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

0.20 REF

b

D2

L

PIN ONE

E2

1

8

15

10

D

E

B

A

C

0.15

C

0.15

2X

2X

e

2

16X

16X

0.10 C

0.05 C

A B

NOTE 3

A

16X

K

A1

(A3)

SEATING

PLANE

C

0.08

C

0.10

0.80

1.00

L

0.35

0.45

1.85

2.15

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

REFERENCE

TOP VIEW

SIDE VIEW

NOTE 4

C

0.15 C A B

0.15 C A B

DETAIL A

BOTTOM VIEW

e/2

L1

---

0.15

74FST3257/D

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