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FSSD06 数据表(PDF) 4 Page - ON Semiconductor |
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FSSD06 数据表(HTML) 4 Page - ON Semiconductor |
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4 / 15 page ![]() © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FSSD06 • Rev. 1.0.5 3 Typical Application Diagram CMD, DAT[3:0] 5 1.65 – 3.60V WiFi, Bluetooth, MMC or SD Module Processor VDDH GND /OE S 1CMD, 1DAT[3:0] FSSD06 Secure Data / Multimedia Card 2:1 Peripheral Expander CLK 1CLK 5 2CMD, 2DAT[3:0] WiFi, Bluetooth, MMC or SD Module ,, 2CLK 5 V DD H to 3.6V VDDC1 V DD H to 3.6V VDDC2 GND RT GND RT Note : External resistors (R T) are recommended if card supplies are allowed to float in the application. The resistors should be >500K to minimize power consumption. Figure 4. Typical Application Diagram Functional Description The FSSD06 enables sharing the ASIC/baseband processor SDIO port(s) to two peripheral cards, providing bi-directional support for dual-voltage SD/SDIO or MMC cards available in the marketplace. Each SDIO port of the FSSD06 has its own supply rail, allowing peripheral cards with different supplies to be interfaced to the host. The peripheral card supplies must be equal or greater than the host to minimize power consumption. The independent VDDH, VDDC1, and VDDC2 are defined by the supplies connected from the application Power Management ICs (PMICs) to the FSSD06. The clock path is a uni-directional buffered path rather than a bi-directional switch port. CMD, DAT Bus Pull-ups The 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0] ports do not have, internally, the system pull-up resistors as defined in the MMC or SD card system bus specifications. The system bus pull-up must be added external to the FSSD06. The value, within the specific specification limits, is a function of the individual application and type of card or peripheral connected. For SD card applications, the RCMD and RDAT pull-ups should be between 10k Ω and 100kΩ. For MMC applications, the RCMD pull-ups should be between 4.7k Ω and 100kΩ and the RDAT pull-ups between 50k Ω and 100kΩ. The card-side 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0] outputs have a circuit that facilitates incident wave switching, so the external pull-up resistors ensure retention of the output high level. The /OE pin can be used to place the 1CMD, 2CMD, 1DAT[3:0] and 2DAT[3:0] into high-impedance mode when the system enters IDLE state (see IDLE State CMD/DAT Bus “Parking” ). CLK Bus The 1CLK and 2CLK outputs are bi-state buffer architectures, rather than a switch I/O, to ensure 52MHz incident wave switching. When there is no communication on the bus (IDLE), the FSSD06 can be disabled with the /OE pin. When this pin is pulled HIGH, the nCLK outputs are also pulled HIGH. Along with nCMD, nDAT[3:0] goes high-impedance to ensure that the CLK path between the FSSD06 and the peripheral does not float. IDLE State CMD/DAT Bus “Parking” The SD and MMC card specifications were written for a direct point-to-point communication between host controller and card. The introduction of the FSSD06 in that path, as an expander, requires that the functional operation and system latency not be impacted by the FSSD06 switch characteristics. Since there are various card formats, protocols, and configurable controllers, a /OE pin is available to facilitate a fast IDLE transition for the nCMD/nDAT[3:0] outputs. Some controllers, rather than simply placing CMD/DAT into high-impedance mode, may pull their outputs HIGH for a clock cycle prior to going into high-impedance mode (referred to as “parking” the output). Some legacy controllers pull their outputs HIGH versus high impedance. If the /OE pin is left LOW and the controller places the CMD/DAT[3:0] outputs into high impedance, the nCMD/nDAT[3:0] output rise time is a function of the RC time constant through the switch path. It is recommended that the host controller pull CMD and DAT[3:0] HIGH for one cycle before pulling /OE HIGH. This facilitates parking all nCMD/nDAT[3:0] outputs HIGH before putting the switch I/Os in high impedance. |
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