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FSUSB11 数据表(PDF) 9 Page - ON Semiconductor |
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FSUSB11 数据表(HTML) 9 Page - ON Semiconductor |
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9 / 12 page ![]() © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 • Rev. 1.0.4 8 Physical Dimensions BOTTOM VIEW TOP VIEW RECOMMENDED LAND PATTERN SIDE VIEW 2X 2X NOTES: A. PACKAGE CONFORMS TO JEDEC REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. PRESENCE OF CENTER PAD IS PACKAGE SUPPLIER DEPENDENT. IF PRESENT IT IS NOT INTENDED TO BE SOLDERED AND HAS A BLACK OXIDE FINISH. E. DRAWING FILENAME: MKT-MAC10Arev5. 0.10 C 0.10 C 0.10 CA B 0.05 C PIN1 IDENT IS 2X LONGER THAN OTHER LINES A B C 0.35 0.25 9X 9X 14 9 6 0.25 0.15 10 5 0.50 0.56 1.62 0.05 0.00 0.05 C 0.55 MAX 0.05 C 1.60 2.10 (0.35) (0.25) 0.50 10X 10X (0.11) 1.12 1.62 KEEPOUT ZONE, NO TRACES OR VIAS ALLOWED (0.20) (0.15) 0.35 0.25 0.35 0.25 DETAIL A DETAIL A 2X SCALE 0.35 0.25 0.65 0.55 D ALL FEATURES (0.36) (0.29) 0.56 Figure 13. 10-Lead, MicroPak™, JEDEC MO255,1.6 X 2.1mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status L10X Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed |
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