© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSUSB31 Rev. 1.1.0

12

Figure 23. 8-Lead MicroPak, 1.6mm Wide

For MicroPak™ tape and reel specifications, please visit Fairchild’s website:

http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

(0.09)

(0.1)

(0.2)

1.6

2X

0.05

0.00

1.6

2X

C

4

3. DRAWING CONFORMS TO ASME Y.14M-1994

2. DIMENSIONS ARE IN MILLIMETERS

1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD

BOTTOM VIEW

4. PIN 1 FLAG, END OF PACKAGE OFFSET

MAC08AREV4

1

23

5

6

7

8

Notes:

8X

0.25

0.35

3X

8X

1.0

4

0.5

8X

0.25

0.15

0.10

C A B

0.05

C

TOP VIEW

INDEX AREA

B

Recommended Landpattern

A

0.55 MAX

DETAIL A

0.35

0.25

(0.15)

(0.20)

0.35

0.25

DETAIL A

PIN #1 TERMINAL

SCALE: 2X

5. DRAWING FILE NAME: MKT-MAC08AREV4