© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSUSB45 • Rev. 1.0.7

8

Physical Dimensions

Figure 16.

10-Lead

MicroPak™

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision.

Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/dwg/MA/MAC10A.pdf.

BOTTOM VIEW

TOP VIEW

RECOMMENDED LAND PATTERN

SIDE VIEW

2X

2X

NOTES:

A. PACKAGE CONFORMS TO JEDEC

REGISTRATION MO-255, VARIATION UABD .

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. PRESENCE OF CENTER PAD IS PACKAGE

SUPPLIER DEPENDENT. IF PRESENT IT

IS NOT INTENDED TO BE SOLDERED AND

HAS A BLACK OXIDE FINISH.

E. DRAWING FILENAME: MKT-MAC10Arev5.

0.10 C

0.10 C

0.10

C A B

0.05

C

PIN1 IDENT IS

2X LONGER THAN

OTHER LINES

A

B

C

0.35

0.25

9X

9X

1

4

9

6

0.25

0.15

10

5

0.50

0.56

1.62

0.05

0.00

0.05 C

0.55 MAX

0.05 C

1.60

2.10

(0.35)

(0.25)

0.50

10X

10X

(0.11)

1.12

1.62

KEEPOUT ZONE, NO TRACES

OR VIAS ALLOWED

(0.20)

(0.15)

0.35

0.25

0.35

0.25

DETAIL A

DETAIL A 2X SCALE

0.35

0.25

0.65

0.55

D

ALL FEATURES

(0.36)

(0.29)

0.56