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www.fairchildsemi.com

FSUSB73 • Rev. 1.0.2

9

Physical Dimensions

Figure 20. 16-Pin Ultrathin Molded Leadless Package (UMLP)

Order Number

Operating

Temperature Range

Package Description

Packing

Method

FSUSB73UMX

-40 to 85°C

16-Terminal Ultrathin Molded Leadless Package (UMLP)

Tape & Reel

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty

therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP16Arev4.

F. TERMINAL SHAPE MAY VARY ACCORDING

TO PACKAGE SUPPLIER, SEE TERMINAL

SHAPE VARIANTS.

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

PIN#1 IDENT

PIN#1 IDENT

PACKAGE

EDGE

TOP VIEW

BOTTOM VIEW

0.10 C

0.08 C

2.60

1.80

0.10 C

2X

2X

SIDE VIEW

0.10 C

0.05

0.00

0.10 C A B

0.05 C

0.55 MAX.

0.40

1

5

9

13

16

2.10

2.90

0.40

0.663

0.563

0.225

1

(15X)

(16X)

0.152

0.40

0.60

0.10

0.30

0.50

0.10

TERMINAL SHAPE VARIANTS

0.15

0.25

15X

PIN 1

NON-PIN 1

0.15

0.25

15X

0.30

0.50

0.15

0.25

0.30

0.50

0.15

0.25

15X

15X

Supplier 1

Supplier 2

PIN 1

NON-PIN 1

A

B

C

SEATING

PLANE

0.45

0.35

0.55

0.45

0.25

0.15

R0.20