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FUSB303 数据表(PDF) 3 Page - ON Semiconductor |
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FUSB303 数据表(HTML) 3 Page - ON Semiconductor |
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3 / 19 page ![]() FUSB303 www.onsemi.com 3 ORDERING INFORMATION TABLE Table 1. AVAILABLE PART NUMBERS Part Number Top Mark Operating Temperature Range Package Packing Method† FUSB303TMX UD −40 to 85 °C 12−Lead Ultra−thin Molded Leadless Package (QFN) 1.6 mm x 1.6 mm x 0.375 mm Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. BLOCK DIAGRAM Figure 3. FUSB303 Block Diagram SRC , SRC +Acc, SNK, SNK+Acc, DRP & DRP+Acc State Machines VDD INT_N / OUT3 SDA / OUT1 SCL / OUT2 CC1 CC2 GND VBUS_DET FUSB 303 PORT / DEBUG _N ID I2C Slave CC Switches , I(Rp)/Rd & Comparators Block Osc EN _N BG ADDR/ ORIENT VDD |
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