3312-2mmSMDTrimmingPotentiometer

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ModelCST0612CurrentSenseResistor

Reliability Tests

Test Item

Reference Standard

Test Conditions

Test Limits

Temperature Coefficient of Resistance

IEC 60115-1-4.8

JIS-C5201-4.8

+25 °C ~ +125 °C

Refer 4.0

Load Life

IEC 60115-1-4.25.1

JIS-C5201-4.25.1

1000 hours at rated power, 70 °C,

1.5 hours “ON”, 0.5 hours “OFF”

< ±2 %

Short Time Overload

IEC 60115-1-4.13

JIS-C5201-4.13

5 times rated power

for 10 seconds

< ±0.5 %

Moisture No Load

IEC60115-1-4.24.2.1a

JIS-C5201-4.24.2.1a

85 °C, 85 %RH, 1000 hours

< ±0.5 %

Temperature Cycle

IEC60115-1-4.19

JIS-C5201-4.19

-55 °C and +155 °C, 300 cycles,

15 minutes per extreme condition

< ±0.5 %

Resistance to Soldering Heat

IEC60115-1-4.18

JIS-C5201-4.18

260 ° ±5 °C for 10 ±1 seconds,

2 cycles

< ±0.5 %

Solderability

IEC60115-1-4.17

JIS-C5201-4.17

245 ±5 °C, 2 ±0.5 seconds

At least 95 % of surface area of

electrode shall be covered with

new solder

High Temperature Exposure

IEC60115-1-4.23.2

JIS-C5201-4.23.2

170 °C, 1000 hours

< ±2 %

Low Temperature Storage

IEC60115-1-4.23.4

JIS-C5201-4.23.4

-55 °C, 1000 hours

< ±0.5 %

Substrate Bending

IEC60115-1-4.33

JIS-C5201-4.33

2 mm bending width

< ±0.5 %

Insulation Resistance

IEC60115-1-4.6

JIS-C5201-4.6

100 V DC for 1 minute

> 100 megohms

Product Dimensions

DIMENSIONS:

MM

(INCHES)

3.05±0.25

(.120±.010)

1.65±0.20

(.065±.008)

0.40±0.25

(.016±.010)

0.51±0.13

(.020±.005)

0.51±0.13

(.020±.005)

0.65±0.20

(.026±.008)

1.0

(.039)

0.7

(.028)

0.40

(.016)

0.80

(.031)

2.3

(.091)

Recommended Solder Pad Layout

3.05±0.25

(.120±.010)

1.65±0.20

(.065±.008)

0.40±0.25

(.016±.010)

0.51±0.13

(.020±.005)

0.51±0.13

(.020±.005)

0.65±0.20

(.026±.008)

1.0

(.039)

0.7

(.028)

0.40

(.016)

0.80

(.031)

2.3

(.091)

Copper foil min.

thickness of PCB: 3 oz.

Derating Curve

100

80

60

40

20

0

-55

0

70

170

Ambient Temperature (°C)