DESD2FLEX2SOQ

Document number: DS39060 Rev. 2 - 2

2 of 5

www.diodes.com

November 2016

© Diodes Incorporated

DESD2FLEX2SOQ

Characteristic

Symbol

Value

Unit

Conditions

Peak Pulse Power Dissipation

230

W

8/20µs, per Figure 1

Peak Pulse Current

5

A

8/20µs, per Figure 1

ESD Protection

– Contact Discharge

±30

kV

IEC 61000-4-2 Standard

ESD Protection

– Air Discharge

±30

kV

IEC 61000-4-2 Standard

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Package Power Dissipation (Note 6)

300

mW

Thermal Resistance, Junction to Ambient (Note 6)

417

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Standoff Voltage

—

—

24

V

—

Channel Leakage Current (Note 7)

—

<1

10

nA

Clamping Voltage, Positive Transients

—



—

34

V

—

—

41

Breakdown Voltage

25.4

28.0

30.3

V

Differential Resistance

—



0.4

—

Ω

Channel Input Capacitance

—

25

30

pF

Notes:

6. Device mounted on FR-4 PCB pad layout (2oz copper) as shown in Diodes Incorporated

’s package outline PDFs, which can be found on our website at

http://www.diodes.com/package-outlines.html.

7. Short duration pulse test used to minimize self-heating effect.

-10

0

10

20 30

40

50 60

70

80 90 100

TIME (ns)

Figure 2 ESD Discharge Current Wave Form

IEC 6100-4-2 (330 /150pF)



Rise time = 0.7ns to 1ns

0

20

40

60

80

100

120

27

53

80

40

20

0

t, TIME (µs)

Figure 1 Pulse Waveform

100

50

0

I

,

P

E

A

K

P

U

L

S

E

C

U

R

R

E

N

T

(

%

I

)

P

P

P

P

t = 8µs

R

Peak Value I

PP

Half Value I

8x20 Waveform

as defined by R.E.A.