E32-R16 datasheet(39/108 Pages) OMRON

39 / 108 page

E32

DIFFUSE, CONVERGENT TYPES (CONT.)

Legend:

E3X-A (General purpose amplifier)

.......

DAN-HS E3X-DAN (Digital amplifier-- high speed mode)

DAN-LD E3X-DAN (Digital amplifier-- long distance mode)

DAN-SM E3X-DAN (Digital amplifier-- standard distance mode)

E3X-F (High performance amplifier-- high speed)

.......

E3X-H11 (High gain amplifier)

.......

E3X-NM (4 channel auto-tuning amplifier)

.....

E3X-NT (Auto-tuning amplifier: general purpose)

.....

E3X-NH (High-precision, auto-tuning amplifier)

.....

NHB

E3X-NHB (High-precision, blue LED, auto-tuning amp)

....

E3X-NV21 (Water-resistant, red light source amplifier)

.....

NVG

E3X-NVG21 (Water-resistant, green light source amp)

....

E3X-VG (Mark sensing amplifier)

.....

Application Features

Appearance

Type

Detection distance

(see note)

Min. detectable

object (gold wire)

Part number

Wafer

Convergent beam

3.3 mm

0.03 mm dia.

E32-L25

Wafer

detection,

height

Convergent beam

suppresses back-

ground objects;

DAN-HS

3.3 mm

--------------------------

E32-L25

height

differences

ground objects;

cable exits the side;

2 m (6.56 ft) length

DAN-LD

3.3 mm

--------------------------

differences cable exits the side;

25 mm bending

radius

DAN-SM

3.3 mm

0.01 mm dia.

radius

3.3 mm

0.5 mm dia.

3.3 mm

0.015 mm dia.

3.3 mm

0.012 mm dia.

NHB

3.3 mm

0.015 mm dia.

3.3 mm

0.012 mm dia.

3.3 mm

0.012 mm dia.

NVG

Wafer

Convergent beam

b k

3.3 mm

0.03 mm dia.

E32-L25A

Wafer

detection,

height

Convergent beam

suppresses back-

ground objects;

DAN-HS

3.3 mm

--------------------------

E32-L25A

height

differences

ground objects;

cable exits the

DAN-LD

3.3 mm

--------------------------

bottom; 25 mm

bending radius

2 m (6.56 ft) length

DAN-SM

3.3 mm

0.01 mm dia.

bending radius

2 m (6.56 ft) length

3.3 mm

0.5 mm dia.

3.3 mm

0.015 mm dia.

3.3 mm

0.012 mm dia.

NHB

3.3 mm

0.015 mm dia.

3.3 mm

0.012 mm dia.

3.3 mm

0.012 mm dia.

NVG

Wafer

Long distance con-

7.2 ± 1.8 mm

0.015 mm dia.

E32-L25L

Wafer

detection,

height

Long distance con

vergent beam type

suppresses back-

2 m (6 56 ft) length

DAN-HS

7.2 ± 1.8 mm

--------------------------

E32-L25L

height

differences

suppresses back-

ground objects;

2 m (6.56 ft) length

DAN-LD

7.2 ± 1.8 mm

--------------------------

;

cable exits the side;

10 mm bending

DAN-SM

7.2 ± 1.8 mm

0.01 mm dia.

10 mm bending

radius

7.2 ± 1.8 mm

0.015 mm dia.

7.2 ± 1.8 mm

0.015 mm dia.

7.2 ± 1.8 mm

0.012 mm dia.

NHB

7.2 ± 1.8 mm

0.015 mm dia.

7.2 ± 1.8 mm

0.012 mm dia.

7.2 ± 1.8 mm

0.012 mm dia.

NVG

Note: Sensing distance is based on sensing a white paper that has 90% reflectivity.

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