DSA30C150PC

preliminary

W

c2

A

A1

c

E

2x e

3

2

1

1.78

(0.07)

2.54 (0.100)

10.92

(0.430)

mm (Inches)

Recommended min. foot print

3x b2

E1

2x b



Supplier

Option

4

min

max

min

max

A

4.06

4.83

0.160

0.190

A1

A2

b

0.51

0.99

0.020

0.039

b2

1.14

1.40

0.045

0.055

c

0.40

0.74

0.016

0.029

c2

1.14

1.40

0.045

0.055

D

8.38

9.40

0.330

0.370

D1

8.00

8.89

0.315

0.350

D2

E

9.65

10.41

0.380

0.410

E1

6.22

8.50

0.245

0.335

e

e1

H

14.61

15.88

0.575

0.625

L

1.78

2.79

0.070

0.110

L1

1.02

1.68

0.040

0.066

W

typ.

0.02

0.040

typ.

0.0008

0.002

Dim.

Millimeter

Inches

typ. 0.10

typ. 0.004

2.41

0.095

0.098

4.28

0.169

All dimensions conform with

and/or within JEDEC standard.

2,54 BSC

0,100 BSC

2.5

1

2

3

Outlines

TO-263 (D2Pak)

IXYS reserves the right to change limits, conditions and dimensions.

20180713a

Data according to IEC 60747and per semiconductor unless otherwise specified

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