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DSA30C200PC 数据表(PDF) 3 Page - IXYS Corporation |
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DSA30C200PC 数据表(HTML) 3 Page - IXYS Corporation |
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3 / 4 page ![]() DSA30C200PC preliminary Ratings Product Marking Date Code Part No. Logo Assembly Code XXXXXXXXX IXYS Zyyww 000000 Assembly Line D S A 30 C 200 PC Part description Diode Schottky Diode low VF Common Cathode TO-263AB (D2Pak) (2) = = = DSA30C200IB TO-262 (I2Pak) (3) 200 Current Rating [A] Reverse Voltage [V] = = = = Package Top °C T VJ °C 175 virtual junction temperature -55 Weight g 2 Symbol Definition typ. max. min. Conditions operation temperature Unit F C N 60 mounting force with clip 20 I RMS RMS current 35 A per terminal 150 -55 TO-263 (D2Pak) Similar Part Package Voltage class DSA30C200PB TO-220AB (3) 200 Delivery Mode Quantity Code No. Ordering Number Marking on Product Ordering DSA30C200PC 524405 Tape & Reel 800 DSA30C200PC Standard T stg °C 150 storage temperature -55 threshold voltage V 0.53 mΩ V0 max R0 max slope resistance * 7.6 Equivalent Circuits for Simulation T = VJ I V 0 R0 Schottky 175 °C * on die level IXYS reserves the right to change limits, conditions and dimensions. 20180713a Data according to IEC 60747and per semiconductor unless otherwise specified © 2018 IXYS all rights reserved |
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